Supply of Deep Engraving Equipment Tender

• Country: France
• Summary: Supply of Deep Engraving Equipment
• FRT Ref No: 132357836
• Deadline: 20 Jan 2026
• Financier: Self Financed
• Purchaser Ownership: Government
• Tender Value: Refer Document
• Notice Type: Tender
• Document Ref. No.: 848522-2025
• Purchaser's Detail:
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• Description:
• CEA-LETI wishes to acquire 200 mm equipment with a 200 mm deep silicon etching chamber. The silicon deep etch chamber must be able to perform Bosch and non-Bosch Si etch processes, be gas compatible fluorinated and carry out the etching through the wafer. This equipment must be able to process different types of substrates in automatic mode, without modification or material change: bonded wafers (silicon on SOG glass and silicon on silicon), pads of different thicknesses, pads with organic layers on the back and pads with engraved cavities on the back. The tool must be equipped with an OES end-of-process detection system, an insert beveled edge protection system and an end-of-process detection system for Via Reveal engraving. The obligatory option: - Option n°1: Level 1 maintenance training Optional options: -Option #2: Chiller -Option n°3: Pump -Option n°4: Electrical transformer -Option n°5: Advanced maintenance training -Option n°6: 1 additional year warranty extension Supply of deep engraving equipment CEA-LETI wishes to acquire 200 mm equipment with a 200 mm deep silicon etching chamber. The room silicon deep etch must be able to perform Bosch and non-Bosch Si etching processes, be compatible with fluorinated gases, and perform through-the-wafer etching. This equipment must...
• Documents:

 Tender Notice